Keynotes
Transforming Embedded Computing: The Road to 15 billion Connected Devices
On-Demand in Auditorium
Doug Davis, Vice President of the Digital Enterprise Group and General Manager of the Embedded and Communications Group.
Welcome to the next evolution of embedded systems technology. Today there are roughly five billion devices connected to the Internet, a figure expected to surge to more than 15 billion by the year 2015 due to the explosive growth of embedded devices that will seamlessly connect our digital worlds at home, at work, in our cars, at the doctor’s office and beyond.
In this session, Doug Davis, Vice President of the Digital Enterprise Group and General Manager of the Embedded and Communications Group, will talk about the emerging trends that are transforming embedded computing around Machine to Machine (M2M) and pervasive connectivity. Developers will further get keen insight as to how Embedded IA in particular is evolving to deliver new capabilities and market opportunities to create new generations of embedded systems for an increasingly connected world.
Doug Davis is a Vice President of the Digital Enterprise Group (DEG) and General Manager of the Embedded and Communications Group (ECG). He is responsible for Intel’s business in the embedded and communications infrastructure market segments. The embedded business provides support for the broad range of Intel Architecture processors and platforms in applications that range from very low power to high performance. ECG supports customers developing applications in areas such as information kiosks, point-of-sale terminals, industrial automation, medical, infotainment, and digital security and surveillance. ECG is also a key player in the communications industry’s move to modular building blocks and the broad adoption of embedded Intel® architecture processors.
Technology as the Catalyst: Shaping the Embedded Transformation
On-Demand in Auditorium
Pranav Mehta, Senior Principal Engineer and Chief Technology Officer of Intel’s Embedded and Communications Group
What do wearable, life-saving medical devices and large wind turbines that generate renewable energy have in common? From the smallest Atom™ processor to the multi-core muscle power of the latest Xeon®, technology from Intel and its partners serves as the pulse of these cutting-edge embedded applications.
In this session, Pranav Mehta, Senior Principal Engineer and Chief Technology Officer of Intel’s Embedded and Communications Group, will discuss how Intel technology available today, from System-on-Chip (SoC) to QuickAssist and multi-core, will pave the way to 15 billion interconnected embedded devices by the year 2015. Embedded developers will also hear critical information about scalability across Intel architecture from high-end to small form factor devices, and how they can use various techniques and tools to tweak applications as they needed to meet the power, efficiency and thermal requirements of emerging applications that will power the embedded Internet of tomorrow.
Pranav Mehta is a Sr. Principal Engineer and CTO for the Embedded & Communications Group within Intel’s Digital Enterprise Group. His team focuses on optimizing the Embedded Intel Architecture (IA) building blocks for the Communications, Storage, and Embedded market segments. This involves understanding performance bottlenecks in IA CPU and System architectures for these application segments; developing solutions to remove those bottlenecks; and modeling these solutions to ensure proper ROI before incorporating them into IA silicon. He has led architecture development of several embedded IA chipsets and SOCs.