Advantech Empowers Innovations with Intel^® architecture in the Connected eWorld

On-Demand in Auditorium

System integrators all over the world are constantly developing innovative applications to advance the quality of our daily lives. Advantech's mission is to empower these innovations by providing leading-edge products and services. This presentation will focus on how we design and manufacture eco-friendly embedded devices based on processors such as Intel^® Atom^™ and multi-core, and how we draw on the ground breaking performance of the Intel^® Xeon^® 5500 series to power the infrastructure which allows those devices to connect. The presentation will focus on 3 main topics:

• Enabling Digital Healthcare
• Advancing In-Vehicle Infrastructure
• Powering packet processing in the communications network

Presented by Paul Stevens, Telecom Sector Marketing Director, Advantech

Paul Stevens has focused on product sales and technology marketing roles since he joined Advantech in 2002. Prior to that he was European Marketing Manager at Motorola and held various key account sales positions. In the past Paul participated actively in VMEbus and sub-bus committees at the IEC as well as presiding GRoupIPC for 5 years after co-founding it in 1992. He studied Electrical and Electronic Engineering at Watford College , UK

Presented by Joe Zhou, SAG Product Manager

Joe Zhou joined Advantech (US) in 2007 as Product Manager for the system-level products. He specializes in fleet management segment and is responsible for the In-Vehicle computers, Industrial Tablet PCs, Mobile Data Terminals, and Embedded Box Computers. Prior to Advantech, he was the Electrical Engineer at Telenetics which is a wireless networking company. Mr. Zhou holds a Bachelor of Science degree in Electrical Engineering from the University of California, Irvine, USA.

Presented by Joseph Chung, Medical Product Manager

Joseph Chung joined Advantech (US) as Product Manager of medical computing products, including Medical-grade Panel PC, Medical Tablet PC, desktop PC, and display console. Prior to Advantech, he was the Product Manager of embedded and networking products at MSI, managing both standard products and OEM key accounts. Mr. Chung received his Masters in Industrial Engineering at NC State University, NC, USA and B.S. in Mechanical Engineering at the National Central University, Taiwan.

Harnessing the power of the next generation Intel^® Xeon^® 5500 processor series for embedded computing

On-Demand in Auditorium

Intel Embedded and Communications Group (ECG) will be presenting a post-launch overview of this next generation platform including the latest Intel^® Xeon^® 5500 processor series. Topics will include a Platform Overview, Usage Examples, Thermal boundary considerations, and micro architecture technical highlights.

Attendees will learn how to leverage next generation Intel^® Xeon^® 5500 processor series to:

•	Address embedded market segments including but not limited to CGRMS, Blades, AdvancedTCA (ATCA) Blades
•	Articulate the latest micro architecture features to end customers
•	Articulate key unique and exclusive embedded features to end customers
•	Gain an insight into Intel latest technologies supported on this platform
•	Intel® Turbo Boost Technology2
•	Intel® QuickPath Technology
•	Intel® Hyper-Threading Technology3
•	Intel® Virtualization Technology4 (Intel® VT)

Presented by Bhupesh Agrawal, Embedded and Communications Group, Intel Corporation

Bhupesh Agrawal has worked for Intel since 2001. He is currently a Product Line Manager in the Performance Products division, under the Embedded and Communications Group. In his current role, Bhupesh works with customers and defines platform line requirements for next generation high performance products, develop launch plans and establish products into Embedded Markets.Bhupesh received a bachelor's degree in Electronics and Instrumentation Controls from Delhi University, India in 1999, and an MBA from Arizona State University in 2007.

Building Next Generation Embedded Systems Using Multi-core and Virtualization

On-Demand in Auditorium

The embedded industry has hit an inflection point. Next generation systems need to deliver more performance, be smaller and more efficient and on top of that innovative. Multi-core processors combined with virtualization technology provide device developers with the tools to deliver this next generation of devices. Understanding and mastering these techniques will be crucial to be able to compete in the embedded marketplace. This course will provide the base for understanding multi-core benefits, the configurations that come with them as well as when to use these configurations and how to develop for them.

Presented by Mark Hermeling, Sr. Product Manager, Virtualization, Wind River

Mark is a Senior Product Manager with Wind River focusing on multicore and virtualization solutions. Prior to joining Wind River, Mark has helped development teams build embedded systems across Asia, Europe and North America in automotive, telecom, consumer electronics and defense industries.

The value of Intel^® Architecture in Digital Signage

On-Demand in Auditorium

Digital Signage is a new and emerging embedded market segment with tremendous potential for advertisers and end customers. This presentation will provide an overview of the market opportunity, usage models and applications. The presenter will show how Embedded Intel Architecture’s scalable roadmap in combination with Intel’s ecosystem (Software vendors, board vendors, integrators, etc) can simplify the implementation of Digital Signage applications accelerating the time to market for OEMs and end users.

Presented by Jose Avalos, Digital Signage Director, Embedded and Communications Group, Intel Corporation

Jose Avalos is the Director of Digital Signage at Intel's Embedded Computing Division (ECD). Previously, Jose was the General Manager for the Ultrawideband Networking Operation at Intel's New Business Initiatives organization. He is a 22 years veteran of the Semiconductor Industry with the last 20 years at Intel. He has held various General Management and director level positions at Intel in Marketing and Sales, Systems Engineering and Platform Engineering. He helped drive Intel’s first platforms in In-Car Computing, Ultraportable Notebooks, Analog Set-Top Boxes, Web Appliances, Digital TV and Print Imaging. Jose has a BSEE from the University of Illinois at Champaign-Urbana and a MSE from Arizona State University.

Intelligent Video: Fact; Fiction; Experience; Opportunities

On-Demand in Auditorium

This course will provide a straightforward view into this fascinating software segment, including what it really is; its real-world industry applications; how it's used today for business intelligence, digital signage and building management needs; and how it works within the Intel^® architecture environment. Presented by ObjectVideo^®, an industry recognized leader in intelligent video, the focus of the session will be on how this technology can be most effectively deployed as a high-value ingredient within a larger video solution. Topics addressed will include importance of solution flexibility; common software and protocols for innovation plus improved video analytic performance; and the significance of platform manageability and ecosystem to the end user.

Presented by Edward Troha, Managing Director, Global Marketing, ObjectVideo, Inc.

Ed Troha is Director of Global Marketing for ObjectVideo, the global leader in the video analytics software space. His role there is twofold: While being responsible for ObjectVideo’s brand, strategic messages and market positioning, he is equally responsible for the development of comprehensive OEM and Technology Partner programs that easily enable partners to include ObjectVideo technology in a wide variety of end user environments. He is particularly focused on how intelligent video can be more effectively leveraged in the critical infrastructure, retail, transportation and banking areas. In addition to his strong creative abilities, he brings more than 20 years of direct sales and marketing experience in technology products and services.

Selecting the best scalable and low power Intel embedded products and platforms for your application needs

On-Demand in Auditorium

This course will help customers identify the best Intel embedded scalable and low power products and platforms to meet their specific application requirements. It will communicate overall product line positioning showing a progression of features, platform benefits and value propositions with simple platform SKU positioning based on customer application.

Presented by Ryan Brown, Embedded and Communications Group, Intel Corporation

Ryan Brown has worked for Intel since 2000. He is currently a Product Line Manager in the Embedded Computing Division, under the Embedded and Communications Group. In his current role, Ryan works with customers and to define platform line requirements for next generation Low Power products, develop launch plans and establish products into Embedded Markets.

Ravi Sirigineedi, Embedded and Communications Group, Intel Corporation

Ravi Sirigineedi has worked for Intel since 1999. He is currently a Product Line Manager in the Embedded Computing Division, under the Embedded and Communications Group. In his role Ravi manages the current generation platforms in the Scalable product line and establishes products into the Embedded Market Segments.

Overview of Intel^® Atom processor-based platforms for embedded computing -- based on the Intel^® Atom processor Z5xx series or the Intel^® Atom™ processor N270

On-Demand in Auditorium

This course covers two Intel^® Atom processor-based platforms for embedded computing -- based on either the Intel^® Atom processor Z5xx series or the Intel^® Atom™ processor N270.   We will discuss the differences between the two platforms, provide an overview of the power savings technologies of the Intel Atom processor, review the feature set and I/O capabilities of the chipsets, including graphics, and discuss additional supported technologies (SSD, wireless and wired Ethernet).

Presented by Robin R. Lowther, Technical Marketing Engineer, Embedded and Communications Group, Intel Corporation

Robin is a Technical Marketing Engineer in the Embedded and Communications Group at Intel Corporation. He received his BSEE from the ITT Technical Institute of Seattle and has been with Intel for 13 years. He's now supporting Intel^® Atom products as a Technical Marketing Engineer for the LEPD Division within the ECG Embedded group.